Introducing BigTwin™, the IT industry’s highest performing twin multi-node system with 4 hot-swap nodes in 2U supporting the highest performance DP Intel® Xeon® E5-2600 v4/v3 product families, a full 24 DIMMs of memory per node, 24 All-Flash NVMe or hybrid drives, three PCI-E 3.0 x16 I/O options per node, and an industry leading 30% better thermal capacity for maximum performance, efficiency and free air cooling (1.05 PUE).
With Supermicro’s 96%+ high-efficiency, fully redundant 2200W, 2600W PowerStick design and advanced thermal architecture the BigTwin is optimized for today and future proofed for the next generation of technology breakthroughs advancements, including new generation Intel Skylake processors.
BigTwin™ is the First and Only 2U Multi-Node System supporting the highest performance 205 watt processors, full 24 DIMMs of memory, 24 All-Flash NVMe Drives and an industry leading 30% better thermal capacity - optimized for today and future proofed for the next generation of technology breakthroughs.
No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.
The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMS per node and 24 All-Flash NVMe drives.
30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W).
Double the I/O capacity with three PCI-E 3.0 x16 expansion slots (Two low-profile and one SIOM) per node and added flexibility with more than 10 networking options including 2x 1GbE, 10G, 25G,100G, IB and industry leading SIOM modular interconnect.
Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 M.2 NVMe/SATA per node.